2227MC-18-03-08-F1

Multicomp
2227MC-18-03-08-F1
Volume Production
MULTICOMP - 2227MC-18-03-08-F1 - SOCKET IC, DIL, 0.3", 18WAY - Farnell CONNECTOR, DIP SOCKET, 18 WAY, PC BOARD; Product Range:2227MC Series; Connector Type:DIP Socket; No. of Contacts:18; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Contact Plating:Tin Plated Contacts; Contact Material:Phosphor Bronze ;RoHS Compliant: Yes - Newark See more descriptions See less descriptions

Connector Type	DIP
Contact Material	Bronze
Contact Plating	Tin
Insulation Resistance	1GR
Number of Contacts	18
Reach SVHC Compliant	No
RoHS Compliant	Yes
Row Spacing	7.62mm

Element14

Datasheet (pdf, 96.3 KB)

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Newark - 98K7083

$0.267

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US: 8,884

1	$0.267
10	$0.267
100	$0.267
1000	$0.267

Element14 - 1103847

S$0.716

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SG: 9,233

10	S$0.716
100	S$0.613
1000	S$0.431

Farnell - 1103847

£0.563

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GB: 8,335

10	£0.563
100	£0.397
1000	£0.27

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