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| Case/Package | SOIC |
| Circuit Type | Bussed |
| Contact Plating | Lead, Tin |
| Depth | 7.62mm |
| Export Control Classification Number (ECCN) Code | EAR99 |
| Height | 2.03mm |
| Harmonized Tariff Schedule (HTS) Code | 8533.21.00.10 |
| Introduction Date | 1998-06-01 |
| Lead Free | Contains Lead |
| Lead Pitch | 1.27mm |
| Length | 11.18mm |
| Lifecycle Status | Production |
| Max Operating Temperature | 125°C |
| Military Standard | Not |
| Min Operating Temperature | -55°C |
| Mount | Surface Mount |
| Number of Circuits | 1 |
| Number of Contacts | 16 |
| Number of Elements | 15 |
| Number of Pins | 16 |
| Number of Resistors | 15 |
| Number of Terminals | 16 |
| Power Dissipation | 1.28W |
| Power Per Element | 80mW |
| Power Rating | 1.28W |
| REACH SVHC | No |
| Resistance | 100kΩ |
| RoHS | Non-Compliant |
| Temperature Coefficient | 100ppm/°C |
| Terminal Pitch | 1.27mm |
| Termination | Gull Wing |
| Thickness | 2.03mm |
| Tolerance | 2% |
| Voltage Rating (DC) | 50V |
| Width | 5.59mm |
| Working Voltage | 50V |
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