| Case/Package |
TSOP |
| Density |
16Mb |
| Interface |
Parallel |
| Max Operating Temperature |
85°C |
| Memory Type |
NOR, |
| Min Operating Temperature |
-40°C |
| Packaging |
Tape and Reel |
| Radiation Hardening |
No |
| RoHS Compliant |
Yes |
Spansion
|
Volume Production
|
Micron Technology
|
End of Life
|
Spansion
|
Volume Production
|
Micron Technology
|
End of Life
|
Micron Technology
|
End of Life
|
Micron Technology
|
End of Life
|
Spansion
|
Volume Production
|
Spansion
|
Volume Production
|
Microchip
|
Volume Production
|
Microchip
|
Volume Production
|
Microchip
|
Not Recommended for New Design
|
Microchip
|
Volume Production
|
Spansion
|
Volume Production
|
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