| Case/Package |
0603 |
| Contact Plating |
Tin, Lead |
| Max Operating Temperature |
150°C |
| Military Standard |
MIL-PRF-55342 |
| Min Operating Temperature |
-55°C |
| Packaging |
Waffle |
| Radiation Hardening |
No |
| Resistance |
1MR |
| RoHS Compliant |
No |
| Temperature Coefficient |
100ppm/°C |
| Tolerance |
1% |
TT Welwyn
|
Volume Production
|
Vishay
|
Volume Production
|
TE Connectivity
|
Volume Production
|
Vishay Dale
|
Volume Production
|
NIC Components
|
Volume Production
|
Multicomp
|
Volume Production
|
TT Welwyn
|
Volume Production
|
Multicomp
|
Volume Production
|
Vishay Dale
|
Volume Production
|
Yageo
|
Volume Production
|
Multicomp
|
Volume Production
|
KOA Speer
|
Volume Production
|
Stackpole Electronics
|
Volume Production
|
Multicomp
|
Volume Production
|
Samsung
|
Volume Production
|
Ohmite
|
Volume Production
|
Vishay Dale
|
Volume Production
|
KOA Speer
|
Volume Production
|
Vishay Dale
|
Volume Production
|
Samsung
|
Obsolete
|
Samsung
|
Obsolete
|
Vishay
|
Volume Production
|
Panasonic
|
Volume Production
|
Yageo
|
Volume Production
|
Panasonic
|
Volume Production
|
Bourns
|
Volume Production
|
TE Connectivity Neohm
|
Volume Production
|
Yageo
|
Volume Production
|
Samsung
|
Volume Production
|
Yageo
|
Volume Production
|
Yageo
|
Volume Production
|
Yageo
|
Unknown
|
Walsin Technologies
|
Volume Production
|
Mitsubishi Kamaya
|
Unknown
|
Walsin Technologies
|
Volume Production
|
Vishay Dale
|
Volume Production
|
Multicomp
|
Volume Production
|
Bourns
|
Obsolete
|
Rohm
|
Volume Production
|
Wieland
|
Volume Production
|
NXP Semiconductors
|
Unknown
|
NXP Semiconductors
|
Unknown
|
Rohm
|
Volume Production
|
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