MC33267

- MC33267

Multicomp
MC33267
Volume Production

MULTICOMP MC33267 Heat Sink, Square, PCB, Extruded, TO-218, TO-220, 3.1 C/W, 63.5 mm, 41.6 mm, 25 mm - Farnell

HEAT SINK; Packages Cooled:TO-218, TO-220; Thermal Resistance:3.1 C/W; External Height - Metric:63.5mm; External Width - Metric:41.6mm; External Length - Metric:25mm; External Diameter - Metric:-; Heat Sink Material:-; Height:63.5mm ;RoHS Compliant: Yes - Newark
Case/Package TO-218
Length 25mm
Natural Thermal Resistance 3.1°C/W
Reach SVHC Compliant No
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Authorized Distributors

Newark - 09R3152

$5.73
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Stock Break
US: 35
1 $5.73
10 $5.73
100 $5.16
1000 $4.02

Element14 - 1710610

S$4.12
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Stock Break
SG: 35
1 S$4.12
10 S$4.12
100 S$3.03
1000 S$2.62

Farnell - 1710610

£3.26
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Stock Break
GB: 35
1 £3.26
10 £2.08
100 £1.71
1000 £1.71
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