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| Projected EOL Date | 2034-10-09 |
| Case/Package | SOIC |
| Contact Plating | Tin |
| Country of Assembly | Thailand |
| Country of Fabrication | United States of America |
| Country of Origin | Thailand |
| Density | 8kb |
| Export Control Classification Number (ECCN) Code | EAR99 |
| Frequency | 3MHz |
| Height | 1.25mm |
| Harmonized Tariff Schedule (HTS) Code | 8542.32.0051 |
| Interface | Serial |
| Introduction Date | 2003-10-09 |
| Lead Free | Lead Free |
| Length | 4.9mm |
| Lifecycle Status | Production |
| Manufacturer Lifecycle Status | REL |
| Max Frequency | 3MHz |
| Max Operating Temperature | 85°C |
| Max Supply Voltage | 5.5V |
| Memory Size | 1kB |
| Memory Type | EEPROM |
| Min Operating Temperature | -40°C |
| Min Supply Voltage | 2.5V |
| Mount | Surface Mount |
| Nominal Supply Current | 3mA |
| Number of Pins | 8 |
| Packaging | Bulk |
| Radiation Hardening | No |
| REACH SVHC | No |
| RoHS | Compliant |
| Schedule B | 8542320050, 8542320050|8542320050|8542320050|8542320050|8542320050 |
| Width | 3.9mm |
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