| Access Time |
5.4ns |
| Access Time-Max |
5.4ns |
| Address Bus Width |
15b |
| Case/Package |
TSOP |
| Data Bus Width |
16b |
| Density |
256Mb |
| Frequency |
133MHz |
| Interface |
Parallel |
| Lead Free |
Contains Lead |
| Max Frequency |
143MHz |
| Max Operating Temperature |
70°C |
| Max Supply Voltage |
3.6V |
| Memory Size |
256Mb |
| Memory Type |
RAM, , SDRAM, Volatile |
| Min Operating Temperature |
0°C |
| Min Supply Voltage |
3V |
| Mount |
Surface Mount |
| Number of Pins |
54 |
| Operating Supply Voltage |
3.3V |
| Organization |
16MX16 |
| Package Quantity |
1 |
| Packaging |
Tape and Reel |
| Radiation Hardening |
No |
| RoHS Compliant |
No |
| Supply Current |
135mA |
Micron Technology
|
Obsolete
|
Micron Technology
|
Obsolete
|
ISSI
|
End of Life
|
ISSI
|
Obsolete
|
Micron Technology
|
Volume Production
|
Micron Technology
|
Obsolete
|
Micron Technology
|
End of Life
|
Micron Technology
|
End of Life
|
ISSI
|
Not Recommended for New Design
|
Micron Technology
|
Obsolete
|
Micron Technology
|
Obsolete
|
Micron Technology
|
Obsolete
|
Micron Technology
|
Obsolete
|
ISSI
|
End of Life
|
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|
Obsolete
|
Micron Technology
|
Obsolete
|
Samsung
|
End of Life
|
Samsung
|
Volume Production
|
Samsung
|
Volume Production
|
ISSI
|
End of Life
|
ISSI
|
Not Recommended for New Design
|
ISSI
|
Obsolete
|
ISSI
|
Obsolete
|
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|
End of Life
|
ISSI
|
Not Recommended for New Design
|
Micron Technology
|
Obsolete
|
ISSI
|
Obsolete
|
ISSI
|
End of Life
|
Samsung
|
Volume Production
|
Samsung
|
Volume Production
|
Micron Technology
|
Obsolete
|
ISSI
|
Not Recommended for New Design
|
ISSI
|
Not Recommended for New Design
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