|
| Case/Package | SMD/SMT |
| China RoHS | Compliant |
| Contact Plating | Tin Bismuth |
| Continuous Drain Current (ID) | 50mA |
| Country of Origin | Mainland China |
| Drain to Source Breakdown Voltage | 15V |
| Drain to Source Voltage (Vdss) | 15V |
| Export Control Classification Number (ECCN) Code | EAR99 |
| Element Configuration | Single |
| Gate to Source Voltage (Vgs) | -10V |
| Height | 1.1mm |
| Harmonized Tariff Schedule (HTS) Code | 8541.21.00.95 |
| Introduction Date | 1999-05-12 |
| Lead Free | Lead Free |
| Length | 2.9mm |
| Lifecycle Status | Production |
| Manufacturer Lifecycle Status | ACTIVE |
| Max Operating Temperature | 150°C |
| Max Power Dissipation | 200mW |
| Min Operating Temperature | -55°C |
| Number of Elements | 1 |
| Number of Pins | 3 |
| Number of Terminals | 3 |
| Packaging | Tape and Reel |
| Power Dissipation | 200mW |
| REACH SVHC | Yes |
| RoHS | Compliant |
| Schedule B | 8541210080, 8541210080|8541210080, 8541210080|8541210080|8541210080, 8541210080|8541210080|8541210080|8541210080 |
| Weight | 7.994566mg |
| Width | 1.5mm |
NXP Semiconductors
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Obsolete
|
InterFET
|
Unknown
|
Central Semiconductor
|
Production
|
onsemi
|
Production
|
NXP Semiconductors
|
Obsolete
|