|
|
|
| Breakdown Voltage | 6V |
| Capacitance | 2.5pF |
| Case/Package | SOT-666 |
| China RoHS | Compliant |
| Clamping Voltage | 17V |
| Contact Plating | Tin |
| Depth | 1.3mm |
| Direction | Unidirectional |
| Element Configuration | Dual |
| ESD Protection | Yes |
| Forward Voltage | 1.1V |
| Height | 600µm |
| Lead Free | Lead Free |
| Leakage Current | 150nA |
| Length | 1.7mm |
| Lifecycle Status | Production |
| Max Breakdown Voltage | 6V |
| Max Junction Temperature (Tj) | 125°C |
| Max Operating Temperature | 125°C |
| Max Repetitive Reverse Voltage (Vrrm) | 5.25V |
| Max Reverse Leakage Current | 150nA |
| Min Breakdown Voltage | 6V |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Number of Bidirectional Channels | 2 |
| Number of Channels | 2 |
| Number of Elements | 1 |
| Number of Pins | 6 |
| Number of Terminals | 6 |
| Peak Pulse Current | 5A |
| Peak Reverse Current | 150nA |
| Polarity | Unidirectional |
| Power Line Protection | Yes |
| Radiation Hardening | No |
| REACH SVHC | Yes |
| Reverse Breakdown Voltage | 6V |
| Reverse Standoff Voltage | 5V |
| RoHS | Compliant |
| Schedule B | 8536300000, 8536300000|8536300000|8536300000|8536300000|8536300000 |
| Termination | SMD/SMT |
| Test Current | 1mA |
| Width | 1.3mm |
| Working Voltage | 5V |
Farnell
Farnell
Farnell
Future Electronics
Future Electronics
Future Electronics
Future Electronics
Future Electronics
Future Electronics
Chip One Stop
Texas Instruments
|
Unknown
|
STMicroelectronics
|
Obsolete
|
Bourns
|
Obsolete
|
Semtech
|
Production
|
Semtech
|
Production
|