Technical Details
Address Bus Width | 8b |
Case/Package | SOIC |
Core Architecture | PIC |
Data Bus Width | 8b |
Frequency | 32MHz |
Height | 1.5mm |
Interface | I2C, SPI, USART, UART, LIN |
Lead Free | Lead Free |
Length | 4.9mm |
Max Frequency | 32MHz |
Max Operating Temperature | 85°C |
Max Power Dissipation | 800mW |
Max Supply Voltage | 5.5V |
Memory Size | 3.5KB |
Memory Type | FLASH |
Min Operating Temperature | -40°C |
Min Supply Voltage | 2.3V |
Number of ADC Channels | 4 |
Number of I/Os | 5 |
Number of I2C Channels | 1 |
Number of Pins | 8 |
Number of Programmable I/O | 6 |
Number of SPI Channels | 1 |
Number of Timers/Counters | 3 |
Oscillator Type | Internal |
Packaging | Rail/Tube |
Peripherals | Brown-out Detect/Reset, POR, PWM, WDT, I2C |
Radiation Hardening | No |
RAM Size | 128B |
Reach SVHC Compliant | No |
RoHS Compliant | Yes |
Series | PIC® XLP™ 12F |
Supply Current | 145uA |
Watchdog Timer | Yes |
Width | 3.9mm |
Compliance
RoHS : Compliant
Radiation Hardening : No
Images
Digikey
Element14
Rs
Farnell
microchipDIRECT
Authorized Distributors
Associate Distributors
Notice
We’re sorry. Your current subscription doesn’t support online BOM analysis. Please sign up for a free SmartParts Analysis trial and check it out.