2227-20-03-07 - Multicomp
SOCKET IC, DIL, 0.3, 20WAY; Product Range:2227 Series; Connector Type:DIP Socket; No. of Contacts:20; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Contact Plating:Tin Plated Contacts; Contact Material:Phosphor Bronze; SVHC:No SVHC (15-Jun-2015); Connector Mounting Orientation:PC Board; Contact Termination:Through Hole Vertical; Contact Termination Type:Through Hole; Insulation Resistance:5000Mohm; Lead Spacing:2.54mm; Operating Temperature Max:105°C; Operating Temperature Min:-45°C; Pin Format:DIP
Technical Details
| Connector Type | DIP |
| Contact Material | Bronze |
| Contact Plating | Tin |
| Insulation Resistance | 5GR |
| Lead Pitch | 2.54mm |
| Max Operating Temperature | 105°C |
| Min Operating Temperature | -45°C |
| Mount | Board |
| Number of Contacts | 20 |
| Row Spacing | 7.62mm |
| Series | 2227 |
| Termination | Through Hole |
Compliance
RoHS : Not Compliant
Images
Element14
Alternatives (Possible Substitutes)
| Manufacturer | Manufacturer Part No. | Lifecycle Status Indicator | Confidence |
|---|---|---|---|
| Multicomp SPC | Volume Production | ||
| TE Connectivity | Not Recommended for New Design | ||
| TE Connectivity | End of Life | ||
| TE Connectivity | Obsolete | ||
| TE Connectivity | Volume Production | ||
| Mill-Max | Volume Production | ||
| Multicomp SPC | Volume Production | ||
| Aries Electronics | Volume Production | ||
| TE Connectivity AMP | Volume Production | ||
| Mill-Max | Volume Production |
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