Technical Details
Case/Package | SO |
Contact Plating | Tin, Matte |
High Level Output Current | -2.6mA |
Lead Free | Lead Free |
Logic Function | NAND GATE |
Low Level Output Current | 2.6mA |
Max Operating Temperature | 125°C |
Min Operating Temperature | -40°C |
Max Supply Voltage | 6V |
Min Supply Voltage | 2V |
Mount | Surface Mount |
Number of Elements | 1 |
Number of Gates | 1 |
Number of Outputs | 1 |
Number of Pins | 5 |
Operating Supply Voltage | 5V |
Packaging | Tape and Reel |
Propagation Delay | 23ns |
Quiescent Current | 20uA |
Radiation Hardening | No |
RoHS Compliant | Yes |
Technology | CMOS |
Compliance
RoHS : Compliant
Radiation Hardening : No
Images
Verical
Alternatives (Possible Substitutes)
Manufacturer | Manufacturer Part No. | Lifecycle Status Indicator | Confidence |
---|---|---|---|
Diodes | Volume Production | ||
ON Semiconductor | Volume Production | ||
NXP Semiconductors | Volume Production | ||
ON Semiconductor | Volume Production | ||
STMicroelectronics | Obsolete | ||
Texas Instruments | Volume Production | ||
Texas Instruments | Volume Production | ||
Texas Instruments | Obsolete | ||
Texas Instruments | Volume Production | ||
Toshiba | End of Life |
Associate Distributors
Notice
We’re sorry. Your current subscription doesn’t support online BOM analysis. Please sign up for a free SmartParts Analysis trial and check it out.