IRD-LPC1768-DEV - FDI
Development Boards & Kits - ARM Ind. Ref. Design LPC1768 Dev Kit V1
Technical Details
Core Architecture | ARM |
Data Bus Width | 32b |
Interface | I2C, SPI, RS-232, USB, Ethernet |
Max Operating Temperature | 85°C |
Min Operating Temperature | -40°C |
Operating Supply Voltage | 5V |
Packaging | Bulk |
Compliance
RoHS : Compliant
Images
Mouser
Notice
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