TR/3216FF3-R - Eaton Bussmann

Fuse Chip Fast Acting 3A 32V SMD Solder Pad 1206 T/R CSA/UL/cULus

Technical Details

Approvals UL, CSA
Case Code (Imperial) 1206
Case Code (Metric) 3216
Case/Package 1206
Current Rating 3A
DC Cold Resistance 36mR
Depth 1.6mm
Fuse Current 3A
Fuse Size 3.2 X 1.6 X 0.89mm
Fuse Type Board Mount (Cartridge Style Excluded)
Height 0.89mm
Lead Free Lead Free
Length 3.2mm
Max Operating Temperature 125°C
Min Operating Temperature -55°C
Max Voltage Rating (AC) 32V
Max Voltage Rating (DC) 32V
Mount Surface Mount
Number of Pins 2
Package Quantity 3000
Packaging Tape and Reel
Primary Type Chip
Radiation Hardening No
Reach SVHC Compliant No
Resistance 36mR
RoHS Compliant Yes
Series Chip 3216FF
Termination SMD/SMT
Voltage Rating 63V
Voltage Rating (AC) 32V
Voltage Rating (DC) 63V
Weight 0.016oz
Width 1.6mm
Working Voltage 63V

Compliance

   RoHS : Compliant
   Radiation Hardening : No

Images

Eaton Bussmann TR/3216FF3-R | Mouser

Mouser

Eaton Bussmann TR/3216FF3-R | Future Electronics

Future Electronics

Lifecycle Status Indicator

   Volume Production
 Loading indicators

Alternatives (Possible Substitutes)

Manufacturer Manufacturer Part No. Lifecycle Status Indicator Confidence
Littelfuse Volume Production
Eaton Bussmann Volume Production
Multicomp Not Recommended for New Design
Eaton Bussmann End of Life
Eaton Bussmann Unknown
Multicomp Volume Production

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